Designs and edits the layouts of MEMS/IC. Provides the processional tools to develop Multi-Chip-Modules (MCM), Chip-on-Board (COB) and other designs. Designs printed circuits known as PCBs with GDS thick film technology or thin film technology. Loads files from Calma GDSII, OASIS, OpenAccess, CIF, DXF, Gerber, LEF, DEF, Lasi, SVG, CSV, PNG, Alliance, ODB++, EDIF or Qucs.
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